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PodLink Platform

PodLink: For PHM, CBM, Snap-in/Snap-out, and In-Flight Data Acquisition

DSPCon's PodLink Platform
Rugged. Flexible. Distributed.
Lowering Costs. Decreasing Risk.

PodLink Platform Overview

The PodLink Control Module and a SensorPodDSPCon introduces a revolution in data acquisition, condition-based maintenance, prognostic health management, and snap-in/snap-out solutions: The PodLink Platform.

Building on DSPCon’s decades-long history of data acquisition and analysis systems, the PodLink™ platform takes advantage of new paradigms in system design.

The PodLink platform serves as the base hardware and software for multiple systems. From a flexible and cost-effective on-board validation platform, to one of the industry’s first hardware platforms for Prognostic Health Management (PHM) and Condition-Based Maintenance (CBM), the PodLink platform offers high-speed/high-value performance and great flexibility.

Built to Lower Costs, Decrease Risk

DSPCon uses a distributed approach to lower testing costs, while increasing reliability.

PodLink is a rugged, low-power and low-cost platform that offers unparalleled modularity, and can be scaled appropriately by customizing hardware and software components for each application. Typically, a system built on the platform would contain one control/processor pod, and at least one SensorPod.

DSPCon uses the PodLink platform to provide a common pod-based architecture that supports as many sensor pods as required, each of which can be sampled at as high a rate as required. The control/processor pod has sufficient processing capability to meet the needs for both current and future data acquisition, CBM, and PHM applications.

For PHM applications, the platform provides the missing common hardware and software platform that is powerful and flexible enough to support complex PHM algorithms, which can be provided by DSPcon, third party developers, or test personnel.

Example System Built on a PodLink Platform

PodLink Architecture Example


Click here to get the PodLink platform overview (PDF).

DSPCon Solutions

PodLink Key Features

  • Lowers risk, cost, and logistics concerns for the aerospace, defense, aviation, and automotive industries
  • Small, rugged, modular design allows system components to be placed directly on or inside the device under test (such as a jet engine, satellite, etc.)
  • High-Performance Processing Power
  • Modular approach scales easily by customizing hardware to support many types of sensors with function-specific data-acquisition modules and software components
PodLink Applications

Use the PodLink platform for applications where scalability, flexibility, rugged performance, and quick set-up are key to lowering costs and mitigating risk:

  • In-flight Data Acquisition
  • On-board validation
  • CBM: Condition Based Maintenance
  • PHM: Prognositc Health Management
  • Snap-in/Snap-out solutions
PodLink SensorPods

To create a complete system, DSPCon designed a family of ruggedized SensorPod units that connect to a PodLink Control/Processor Pod

SensorPods offer interfaces to a broad set of passive and active sensors, covering multiple testing needs.

All SensorPods share the following set of high-level specifications:

  • Dimensions: 3.635" x 3" x .85"
  • Operating range: up to 105 C
  • NIST-traceable calibration
  • ROHS compliant
  • Channel-to-earth ground double isolation barrier

Follow the links below for details on each PodLink SensorPod:

More SensorPods available soon:

  • Octal High-speed Excited SensorPod
  • 32/64 Channel Low-speed SensorPod
  • 16/32 Channel Low-speed Excited SensorPod
  • SerialLink SensorPod
  • Thermocouple SensorPod

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