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Podlink Platform: Control/Processor Pod
PodLink: For PHM, CBM, Snap-in/Snap-out, and In-Flight Data Acquisition

DSPCon's PodLink Platform
Rugged. Flexible. Distributed.
Lowering Costs. Decreasing Risk. 
PodLink: Control/Processor Pod

 Control/Processor Pod

The Control/Processor Pod provides command and control to the entire system, offering interfaces and data processing for each of the sensor-specific SensorPods. This pod aggregates, fuses, and processes all digitzed data according to the requirements of the system.

  • Dimensions: 6 x 6 x 1.32 inches
  • Operates to 85° C
  • Supports up to eight remote pods
  • All control and data supported through standard Ethernet interface
  • Output: 100Base-T Ethernet
  • Compatible with DSPCon MulitiScope Display and other DSPCon post processors
  • Accepts wide range DC power : 18V to 36V
  • Provides centralized power for all remote pods
  • Provide data alignment across 8 distributed pods
  • Operating system: Linux, real-time
  • On board processing capability includes:
  • Intel processor family components
  • Spartan 6 Xlinx FPGA for custom ALU applications
  • ROHS Compliant
  • Solid state or traditional HDD for data storage
PodLink SensorPods

To create a complete system, DSPCon designed a family of ruggedized SensorPod units that connect to a PodLink Control/Processor Pod. 

SensorPods offer interfaces to a broad set of passive and active sensors, covering multiple testing needs.

All SensorPods share the following set of high-level specifications:

  • Dimensions: 3.635" x 3" x .85"
  • Operating range: up to 105 C
  • NIST-traceable calibration
  • ROHS compliant
  • Channel-to-earth ground double isolation barrier

Follow the links below for details on each PodLink SensorPod:

More SensorPods available soon:

  • Octal High-speed Excited SensorPod
  • 32/64 Channel Low-speed SensorPod
  • 16/32 Channel Low-speed Excited SensorPod
  • SerialLink SensorPod
  • Thermocouple SensorPod
PodLink Key Features
Benefits
  • Lowers risk, cost, and logistics concerns for the aerospace, defense, aviation, and automotive industries
  • Small, rugged, modular design allows system components to be placed directly on or inside the device under test (such as a jet engine, satellite, etc.)
  • High-Performance Processing Power
  • Modular approach scales easily by customizing hardware to support many types of sensors with function-specific data-acquisition modules and software components
PodLink Applications

Use PodLink platform for applications where scalability, flexibility, rugged performance, and quick set-up are key to lowering costs and mitigating risk:

  • PHM: Prognositc Health Management
  • CBM: Condition Based Maintenance
  • Snap-in/Snap-out solutions
  • In-flight Data Acquisition
  • On-board validation

 
 
 
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